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#Protel altium designer how to#
#Protel altium designer series#

- Interface the processor to DDR3 memory, PCI Express and DVI transmitter.

#Protel altium designer series#

This second and final part in a series examining PCB design techniques will look at a comparison of DDR2 and DDR3, DDR3 design guidelines, pre-layout analysis, critical placement, design rules, and post-layout analysis.

The cost of the PCB is critical since in most cases, even if a board is redesigned for cost reduction reasons, very rarely is the PCB stackup or layer count changed since it requires extensive redesign and in some cases a complete “do-over.” In order to maximize your cost advantage, it’s important to choose a PCB stackup and.

Compared with DDR3, the DDR4 PCB design consists of several physical changes. DDR4 offers several improvements over its predecessor, including faster download speed, higher DIMM capacities, enhanced data integrity and power efficiency, and overall improved performance.

DDR4 succeeded DDR3 as the next generation of synchronous DRAM (SDRAM) software.Note: Content on this page is applicable. This page also provides simulation guidance.

#Protel altium designer how to#

Arria 10 EMIF Simulation Guidance 9/92/Arria10_Simulation_Flow.jpg Objective This page explains how to extract the parameters to be entered in the 'Board Timing' tab of the Arria 10 External memory Interfaces GUI.

Worked with fabrication house on the Stackup other fabrication requirements Responsibilities included Symbol and Footprint creation, Schematics drawing, Component Placement, Constraint Settings, Layout and getting design ready for Fabrication. Discussed with customers their design expectations and requirements. description date major revision history : ref des description 7 bit address i2c address table : 1.0 1.0 pre-proto build 2 ic eeprom 1mbit 1mhz 8so 1.

pcb mechanical details : notes, unless otherwise specified : k2l schematics pcb layer stack-up details : pcb rev.